Shaping the future of communication | Jobs Reply



This research service focuses on key semiconductor types that enable 5G connectivity in devices and network infrastructure. Key components included include modem ICs/SoC, RFICs, power amplifiers (PA), filters, low-noise amplifiers (LNAs), beamformer ICs, switches, and envelope trackers, among others.

NEW YORK, December 13, 2022 (GLOBE NEWSWIRE) — announces the release of the report, “5G Semiconductors: Fabricating the Future of Communications” –

End-user applications include smartphones, network infrastructure (including small cells), fixed wireless access/customer premise equipment (FWA/CPE), and other emerging 5G areas in automotive, industrial, laptops, tablets, mining, medical, and AR/VR. With various new and emerging 5G use cases, the study sheds light on the changing customer landscape.

Key drivers include the rapid increase in compound semiconductor adoption, accelerating 5G deployment, growing demand for 5G-enabled devices, and the development of advanced chip manufacturing and packaging technologies.

The study also highlights key obstacles such as ongoing geopolitical tensions, supply chain disruptions, consumer industry penetration into chip design and manufacturing, and the need to balance price, technology and capacity.
Read the full report:

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